Feature
C-Cooler is the ultra-thin heat spreaders provides a low-cost, effective means of cooling IC devices in restricted spaces where conventional heat sinks aren’t appropriate.
C-Cooler spreaders consist of 99.99% Oxygen-free copper sandwiched between electrically insulating films and adhesive, will long-term and stable cooling.

High strength PSA (pressure-sensitive adhesive) provides a strong bond to the component. The TYPE-A heat spreaders permits nearly 100% adhesive contact with non-flat package surfaces, Copper has good heat emission could be effective to discharge heat.(K=400)

Function
*Component junction temperature reduction of 10-20°C
*Easily added to existing designs to lower component temperatures, improve reliability.
* Conforms to complex design and non-flat surfaces.
* Allows use in limited environments, highlight the value of application.
* Easier to peel and stick any non-flat component surfaces.
* Costs are kept under control.
* Low application force minimizes risk of damage to component.
* Replace graphite.

Application
* CPU
* Memory Module
* PDA、notebook.
* Communications and Internet
* Various types of heat.